1. 2. 3. material content data sheet sales product name ipd65r660cfda issued 29. august 2013 ma# MA001016866 package pg-to252-3-313 weight* 318.88 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 3.294 1.03 1.03 10330 10330 leadframe non noble metal iron 7439-89-6 0.147 0.05 462 inorganic material phosphorus 7723-14-0 0.044 0.01 139 non noble metal copper 7440-50-8 147.096 46.13 46.19 461292 461893 wire non noble metal aluminium 7429-90-5 0.535 0.17 0.17 1676 1676 encapsulation organic material carbon black 1333-86-4 1.404 0.44 4404 plastics epoxy resin - 24.575 7.71 77066 inorganic material silicondioxide 60676-86-0 114.448 35.89 44.04 358908 440378 leadfinish non noble metal tin 7440-31-5 3.740 1.17 1.17 11729 11729 plating inorganic material phosphorus 7723-14-0 0.003 0.00 11 non noble metal nickel 7440-02-0 1.421 0.45 0.45 4455 4466 solder noble metal silver 7440-22-4 0.074 0.02 233 non noble metal tin 7440-31-5 0.059 0.02 186 non noble metal lead 7439-92-1 2.835 0.89 0.93 8891 9310 heatspreader non noble metal iron 7439-89-6 0.019 0.01 60 inorganic material phosphorus 7723-14-0 0.006 0.00 18 non noble metal copper 7440-50-8 19.177 6.01 6.02 60140 60218 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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